年度98
等級其他
論文名稱Porous structure and thermal stability of photosensitive silica/polyimide composites prepared by sol-gel process
全部作者Huang, Shu-Hui; Don, Trong-Ming; Lai, Wei-Chi; Chen, Ching-Chung; Cheng, Liao-Ping
卷數Journal of Applied Polymer Science 114(4), pp.2019-2029
ISSN(ISBN)1097-4628
使用語言英文
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